发明名称 Cooling device for an electronic component
摘要 A cooling device for cooling an electronic component. The device has an enclosure adapted to contain a liquid coolant. The enclosure has an internal channel system comprising a cavity adjacent the electronic component, a first group of arborizing channels adapted to carry the liquid coolant away from the cavity, a second group of arborizing channels adapted to carry the liquid coolant to the cavity, and a plenum fluidically connecting the first and seconds groups of arborizing channels. Each group of arborizing channels has a parent branch and multiple successive sets of daughter branches with successively smaller cross-sectional areas, wherein the sum of the cross-sectional areas of the daughter branches of any set is approximately the same as that of its parent branch. Distal sets of the daughter branches are most distant from the cavity, fluidically connected to the plenum, and have the smallest cross-sectional areas of the daughter branches.
申请公布号 US8037927(B2) 申请公布日期 2011.10.18
申请号 US20070941550 申请日期 2007.11.16
申请人 CUI GLOBAL, INC. 发明人 SCHUETTE FRANZ MICHAEL
分类号 F28D15/00;F28F7/00;H05K7/20 主分类号 F28D15/00
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