发明名称 Method and apparatus for chip cooling
摘要 In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of a system for cooling a heat-generating device, such as a semiconductor chip, includes a vaporization chamber for at least partially vaporizing a stream of liquid in a stream of a gas to produce a mixture of gas, vapor and liquid and a heat sink coupled to the vaporization chamber for transferring heat from the heat-generating device to the mixture.
申请公布号 US8037926(B2) 申请公布日期 2011.10.18
申请号 US20070766533 申请日期 2007.06.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MARTIN YVES C.;ROMANKIW LUBOMYR T.;VAN KESSEL THEODORE G.
分类号 H05K7/20 主分类号 H05K7/20
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