发明名称 |
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures |
摘要 |
A semiconductor device has dual-molded semiconductor die mounted to opposite sides of a build-up interconnect structure. A first semiconductor die is mounted to a temporary carrier. A first encapsulant is deposited over the first semiconductor die and temporary carrier. The temporary carrier is removed. A first interconnect structure is formed over a first surface of the first encapsulant and first semiconductor die. The first interconnect structure is electrically connected to first contact pads of the first semiconductor die. A plurality of conductive pillars is formed over the first interconnect structure. A second semiconductor die is mounted between the conductive pillars to the first interconnect structure. A second encapsulant is deposited over the second semiconductor die. A second interconnect structure is formed over the second encapsulant. The second interconnect structure is electrically connected to the conductive pillars and first and second semiconductor die.
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申请公布号 |
US8039304(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20090540174 |
申请日期 |
2009.08.12 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A. |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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地址 |
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