| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto; placing a mold chase having a protrusion over the rounded interconnect; forming an encapsulation over the package carrier, the encapsulation having a recess under the protrusion; removing the mold chase to expose the encapsulation; and removing the encapsulation under the recess for exposing the rounded interconnect.
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