| 摘要 |
The present invention includes an illuminance adjustment step of setting an optimum illuminance of the illumination; and a defect inspection step of picking up the image of the substrate illuminated with the illumination at the optimum illuminance, wherein the illuminance adjustment step has: a first step of applying illuminations at different illuminances to a plurality of measurement regions on a front surface of the substrate and picking up an image of each of the measurement regions, while moving the substrate; a second step of making a luminance of the picked up image of each of the measurement regions into a histogram to find a reference luminance where an integral value from a maximum luminance side of the histogram is a predetermined value; and a third step of calculating a correlation between each of the reference luminances and the illuminance, and setting based on the correlation an illuminance at which the reference luminance coincides with a predetermined luminance, as the optimum illuminance.
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