发明名称 |
Linear semiconductor substrate, and device, device array and module, using the same |
摘要 |
The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.
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申请公布号 |
US8039927(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20060386871 |
申请日期 |
2006.03.23 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
NAKAMURA TOSHIHIRO;ORITA NOBUAKI;KOAIZAWA HISASHI;SUZUKI KENKICHI;KURASEKO HIROSHI;KONDO MICHIO |
分类号 |
H01L29/06;H01L31/0352 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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