发明名称 Linear semiconductor substrate, and device, device array and module, using the same
摘要 The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.
申请公布号 US8039927(B2) 申请公布日期 2011.10.18
申请号 US20060386871 申请日期 2006.03.23
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 NAKAMURA TOSHIHIRO;ORITA NOBUAKI;KOAIZAWA HISASHI;SUZUKI KENKICHI;KURASEKO HIROSHI;KONDO MICHIO
分类号 H01L29/06;H01L31/0352 主分类号 H01L29/06
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