发明名称 Solder ball printing apparatus
摘要 The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.
申请公布号 US8038050(B2) 申请公布日期 2011.10.18
申请号 US20100756314 申请日期 2010.04.08
申请人 HITACHI PLANT TECHNOLOGIES, LTD. 发明人 HONMA MAKOTO;IGARASHI AKIO;HASHIMOTO NAOAKI;MUKAI NORIAKI
分类号 B23K3/06 主分类号 B23K3/06
代理机构 代理人
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