发明名称 |
Solder ball printing apparatus |
摘要 |
The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape. |
申请公布号 |
US8038050(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20100756314 |
申请日期 |
2010.04.08 |
申请人 |
HITACHI PLANT TECHNOLOGIES, LTD. |
发明人 |
HONMA MAKOTO;IGARASHI AKIO;HASHIMOTO NAOAKI;MUKAI NORIAKI |
分类号 |
B23K3/06 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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