发明名称 |
LEISTUNGSHALBLEITERMODUL UND VERFAHREN SEINER HERSTELLUNG |
摘要 |
<p>The module has power semiconductor components e.g. diode, spacer units (206) and a foil composite (100) disposed on conductor tracks. The composite has metal foil layers and an electrically insulating foil layer disposed between each adjacent pair of the metal foil layers. The spacer units and components are connected to stamped contact humps (140) of the foil composite, by ultrasonic welding to create a composite. An independent claim is also included for a method for producing a power semiconductor module to be used with circuitry.</p> |
申请公布号 |
AT527692(T) |
申请公布日期 |
2011.10.15 |
申请号 |
AT20040025145T |
申请日期 |
2004.10.22 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
GOEBL, CHRISTIAN;HEILBRONNER, HEINRICH |
分类号 |
H01L25/00;H01L25/07;H01L21/60;H01L21/607;H01L23/538;H01L25/18 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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