发明名称 Rigid-flex moduuli
摘要 Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (20) and a sacrificial-material piece (16) are attached to an insulator membrane (12) in the location of the flexible zone (13). An insulator layer (1), which encloses within itself a sacrificial-material piece (16) is manufactured on the surface of the conductor membrane (12). The flexible zone (13) is formed in such a way that an opening (9) is made in the insulator layer (1), through which the sacrificial-material piece (16) is removed. The flexible zone comprises at least part of the flexible membrane (20) as well as conductors (22), which are manufactured by patterning the insulator membrane (12) at a suitable stage in the method.
申请公布号 FI122216(B) 申请公布日期 2011.10.14
申请号 FI20090005005 申请日期 2009.01.05
申请人 IMBERA ELECTRONICS OY 发明人 IIHOLA, ANTTI;WARIS, TUOMAS
分类号 H05K3/00;H05K1/18 主分类号 H05K3/00
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