发明名称 |
FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFERENCE SHIELDING WITH CORELESS PACKAGES |
摘要 |
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a carrier material, attaching a die in the cavity, wherein a backside of the die comprises a metal filled DBF, forming a dielectric material adjacent the die and on a bottom side of the carrier material, forming a coreless substrate by building up layers on the dielectric material, and removing the carrier material from the coreless substrate. |
申请公布号 |
WO2011126973(A2) |
申请公布日期 |
2011.10.13 |
申请号 |
WO2011US31079 |
申请日期 |
2011.04.04 |
申请人 |
INTEL CORPORATION;NALLA, RAVI K.;DELANEY, DREW |
发明人 |
NALLA, RAVI K.;DELANEY, DREW |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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