EPOXY RESIN BASED MOLDING MATERIAL FOR USE IN SEALING, AND ELECTRONIC COMPONENTS AND DEVICES

摘要

Provided are: an epoxy resin composition for use in sealing, which exhibits excellent moldability and reflow resistance; and electronic components and devices which are provided with elements sealed with the resin composition. An epoxy resin composition for use in sealing, which comprises (A) an epoxy resin, (B) a curing agent, (C) a cure accelerator, (D) an inorganic filler, and (E) a silicon-containing polymer, said silicon -containing polymer (E) having a three-dimensional crosslinked structure and a weight-average molecular weight of 1500 to 7000.