发明名称 FILM SURFACE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To sufficiently react reaction components while preventing contamination from adhering to electrodes during surface treatment of a film to be treated by activation of a reaction gas containing the reaction components.SOLUTION: The film 9 to be treated is wound over a first roll electrode 11 and a second roll electrode 12 in a main treatment section 10. The film 9 is fed from the electrode 11 to the electrode 12 by rotation of the roll electrodes 11, 12. The reaction gas is blown onto the film 9 from a nozzle 23 upstream in the direction of feed from a main discharge space 19 between the electrodes 11, 12 or in the discharge space 19. A re-activation section 30 is provided downstream in the direction of feed from the main treatment section 10. Preferably, the later stage electrode 31 of the reactivation section 30 faces the second roll electrode 12, and the second roll electrode 12 is also used as another later stage electrode for the re-activation section 30. Discharge producing gas not containing reaction components is supplied between the electrodes 31, 12 by a gas supply section 33.
申请公布号 JP2011201079(A) 申请公布日期 2011.10.13
申请号 JP20100068747 申请日期 2010.03.24
申请人 SEKISUI CHEM CO LTD 发明人 SATO TAKASHI;NOGAMI MITSUHIDE;NAKANO YOSHINORI;KAWASAKI SHINICHI
分类号 B29C71/04 主分类号 B29C71/04
代理机构 代理人
主权项
地址