| 摘要 |
<p>Disclosed is an interposer which meets the needs of improving electrical reliability of an electronic device. The interposer (4) is provided with a base (14) having a through hole (P) in the thickness direction, and a through conductor (16) disposed in the through hole (P). The base (14) has: a first inorganic insulating layer (17a) and a second inorganic insulating layer (17b), which are spaced apart from each other in the thickness direction; and a first resin layer (18a), which is disposed between the first inorganic insulating layer (17a) and the second inorganic insulating layer (17b), and which is in contact with the first inorganic insulating layer (17a) and the second inorganic insulating layer (17b). The first resin layer (18a) has a larger thermal expansion coefficient in the thickness direction and the planar direction than that of the first inorganic insulating layer (17a) and that of the second inorganic insulating layer (17b).</p> |
