ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR BONDING, METHOD FOR MOUNTING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for semiconductor bonding, which has high transparency and enables easy recognition of the pattern or position indication during semiconductor chip bonding.SOLUTION: The adhesive for semiconductor bonding includes an epoxy resin, an inorganic filler and a curing agent, and is characterized in that the inorganic filler is contained in the adhesive for semiconductor bonding in an amount of 30-70 wt.% and contains a filler A that has an average particle diameter of less than 0.1 μm and a filler B that has an average particle diameter of 0.1 μm or more but less than 1 μm, with a weight ratio of the filler A to the filler B being 1/9 to 6/4.