| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film which is superior in peelability from a mold and a molding obtained by molding a mold resin and followability to the mold and has heat resistance and mechanical strength at a use temperature of about 180°C.SOLUTION: On at least one side of a film obtained by molding a resin composition prepared by combining at least one thermoplastic elastomer, a fluorosilicone compound layer which is obtained by applying a mold release composition containing a fluorosilicone compound having a silyl group including a hydrolyzable part in a molecule and drying it is formed. |
