发明名称 Polishing Composition and Polishing Method
摘要 A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.
申请公布号 US2011250754(A1) 申请公布日期 2011.10.13
申请号 US201113075791 申请日期 2011.03.30
申请人 FIJIMI INCORPORATED 发明人 HIRANO TATSUHIKO;TAMADA SHUICHI;UMEDA TAKAHIRO
分类号 H01L21/306;B24B37/00;C09K3/14;C09K13/00;H01L21/304 主分类号 H01L21/306
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