| 摘要 |
<p>The distribution of Ni-Si compound grains is controlled to thereby improve the properties of Corson alloys. Disclosed is a copper alloy for electronic materials which contains 0.4-6.0 mass% Ni and 0.1-1.4 mass% Si, with the remainder comprising Cu and incidental impurities, and which has, present therein, small Ni-Si compound grains having a grain diameter of 0.01 µm or greater but less than 0.3 µm and large Ni-Si compound grains having a grain diameter of 0.3 µm or greater but less than 1.5 µm, the population of the small grains being 1-2,000 grains/µm2 and the population of the large grains being 0.05-2 grains/µm2.</p> |
