发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a photospacer having superior alkali developability, exposure sensitivity and resolution, a cured product thereof exhibiting superior adhesion to a substrate and superior elastic recovery characteristics even when a low temperature treatment is adopted.SOLUTION: The photosensitive resin composition is an alkali-developable negative photosensitive resin composition (Q) for a photospacer comprising a polyfunctional (meth)acrylate monomer (A) containing various acid groups or salts thereof, a siloxane compound (B) having two or more hydrolyzable alkoxy groups, and a photoradical polymerization initiator (C), wherein an acid value of the photosensitive resin composition based on the total weight of the components (A) to (C) is 10-110 KOHmg/g, and a content of carbon-carbon double bonds (C=C) in (meth)acryloyl groups in the photosensitive resin composition based on the total weight of the components (A) to (C) is 6.5-10.0 mmol/g.
申请公布号 JP2011203577(A) 申请公布日期 2011.10.13
申请号 JP20100071885 申请日期 2010.03.26
申请人 SANYO CHEM IND LTD 发明人 HASEGAWA SHINPEI
分类号 G03F7/027;C08F290/06;C08F299/00;G03F7/075 主分类号 G03F7/027
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