| 摘要 |
PROBLEM TO BE SOLVED: To form a pattern of a high aspect ratio in a short time in a pattern forming apparatus for forming the pattern of an electrode or the like by curing a coating liquid applied on a substrate using light.SOLUTION: A coating liquid P applied from a discharge port 521 on a lower surface of a discharge nozzle 52 to a wafer W is irradiated with UV light from a pair of light guides 551, 552 provided so as to hold the discharge nozzle 52 from both left and right sides in a nozzle scan moving direction (X direction). Light emitting planes 551a, 552a of the light guides 551, 552 are turned toward a foot Q of a perpendicular falling vertically from the discharge port 521 to the wafer W, thereby irradiating even a side surface of the coating liquid P with the light L1, L2. |
