| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in all of dielectric characteristic, dielectric loss, heat resistance, flame retardancy, moisture resistance, and adhesion with copper foil while using a non-halogen based flame retardant, and to provide a prepreg and a laminate using the same.SOLUTION: The thermosetting resin composition includes: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a specific dielectric constant of ≤2.9 at the frequency of ≥1 GHz. The prepreg is obtained by using the resin composition. The laminate is formed by using and laminating the prepreg. |
