| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-curable optical semiconductor-encapsulating silicone resin composition which is excellent in gas-barrier.SOLUTION: The heat-curable optical semiconductor-encapsulating silicone resin composition comprises (A) component: 100 pts.mass of a silicon compound represented by formula (1): (RSiO)((R)SiO)((R)SiO)(SiO)(XO)and (B) component: 0.001 to 10 pts.mass of a condensation catalyst, wherein R, R, and Rare the same or different from each others and each a monovalent organic group, X is hydrogen or a monovalent organic group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, e is 0 or a positive number, (provided that a-e satisfy the following conditions: b/a is a number of 0 to 10, c/a is a number of 0 to 0.5, d/(a+b+c+d) is a number of 0 to 0.3, and e/(a+b+c+d) is a number of 0.01 to 1.5). |
