POWER MODULE AND POWER CONVERSION DEVICE PROVIDED WITH SAID POWER MODULE

摘要

The disclosed power module is provided with: a semiconductor chip; a first connection conductor having a primary surface connected to one primary surface of the semiconductor chip; a second connection conductor having a primary surface connected to the other primary surface of the semiconductor chip; connection terminals by which power is supplied from a DC power source; and a resin member for sealing the semiconductor chip. The resin member has protrusions protruding from the space formed by placing the first and second connection conductors opposite of one another. The connection terminals are fixed on the protrusions, and at least one of the first and second connection conductors is connected to the connection terminal via a metal member which fuses at a prescribed temperature.