METHOD FOR MONITORING THE AMOUNT OF CONTAMINATION IMPARTED INTO SEMICONDUCTOR WAFERS DURING WAFER PROCESSING
摘要
Methods are disclosed for monitoring the amount of metal contamination imparted during wafer processing operations such as polishing and cleaning. The methods include subjecting a silicon-on-insulator structure to the semiconductor process, precipitating metal contamination in the structure and delineating the metal contaminants.
申请公布号
WO2011077344(A3)
申请公布日期
2011.10.13
申请号
WO2010IB55925
申请日期
2010.12.17
申请人
MEMC ELECTRONIC MATERIALS, INC.;LIBBERT, JEFFREY, L.;FEI, LU