发明名称 CIRCUITRY AND ELECTRICAL JUNCTION BOX
摘要 PROBLEM TO BE SOLVED: To achieve high-density packaging by relieving the stress applied to a soldered portion of a through hole.SOLUTION: A circuitry includes a conductive plate 20 disposed between a first circuit board 30A and a second circuit board 30B that are disposed facing each other, and a through hole a32 penetrating through the second circuit board 30B. The conductive plate 20 is made of a sheet metal, and includes a planar body 21 and a second bus bar 23 that is extended from the body unit 21 in a curved surface shape and includes an extended edge 23B soldered to the through hole a32. The extended edge 23B of the second bus bar 23 can be displaced relatively to the body unit 21.
申请公布号 JP2011205732(A) 申请公布日期 2011.10.13
申请号 JP20100068000 申请日期 2010.03.24
申请人 AUTONETWORKS TECHNOLOGIES LTD;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD 发明人 YAMANE SHIGEKI
分类号 H02G3/16;H01R4/02;H01R12/51;H01R12/55;H05K7/06 主分类号 H02G3/16
代理机构 代理人
主权项
地址