发明名称 |
METAL EMBEDDED GLASS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND MEMS DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal embedded glass substrate that has a low resistance value and contributes to size reduction of a device, and to provide a method of manufacturing the same, and a MEMS device which uses the metal embedded glass substrate.SOLUTION: The metal embedded glass substrate includes a glass substrate 54, having a first principal surface SF1 and a second principal surface SF2 opposed to each other, and a through metal member 55, penetrating between the first principal surface SF1 and the second principal surface SF2 of the glass substrate 54 and made of metal. The through metal member 55 has a diameter which is 100 μm or smaller. |
申请公布号 |
JP2011204950(A) |
申请公布日期 |
2011.10.13 |
申请号 |
JP20100071472 |
申请日期 |
2010.03.26 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
TAURA TAKUMI;OKUMURA MAKOTO;NAKATANI TOMOHIRO |
分类号 |
H01L23/15;B81B3/00;B81C1/00;G01P15/08;H01L29/84 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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