| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which uses existent integrated circuit chips and performs communication between the chips by a contactless communication means.SOLUTION: The semiconductor device includes a router chip 102-1, including a plurality of connection pads 111 to which an external connection pad of a semiconductor chip 101-1 is flip-chip connected and a plurality of contactless communication interface circuits 113 provided corresponding to the plurality of connection pads respectively. By having this router chip 102-1 stacked on a router chip 102-1 mounted with another semiconductor chip 101-2 and having the same constitution 102-2, communications among semiconductior chips are realized. |
