| 摘要 |
PROBLEM TO BE SOLVED: To enable the miniaturization of a thermal head equipped with a printed wiring board.SOLUTION: The thermal head X includes a substrate 7, a plurality of heating parts 9 arranged on the substrate 7, an electrode wiring 21 which is laid on the substrate 7 and has a beltlike section prolonged beltlike along the arrangement direction of a plurality of heating parts 9 and whose beltlike section is electrically connected in common to a plurality of heating parts 9, the printed wiring board 5 which has a printed wiring connected to the electrode wiring 21, and a conductive member 12 which has a base 12A prolonged along the beltlike section of the electrode wiring 21 and a plurality of gripping parts 12B arranged along the beltlike section of the electrode wiring 21 while holding the substrate 7 and the beltlike section of the electrode wiring 21 collectively with the base 12A and the gripping part 12B. A plurality of gripping parts 12B contact the beltlike section of the electrode wiring 21. In proportion to the length of the distance of the position on the electrode wiring 21 where the gripping part 12B is arranged from the connection of the electrode wiring 21 and the printed wiring, the contact area of the gripping part with the beltlike section of the electrode wiring 21 becomes large. |
