发明名称 CAMERA MODULE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device that prevents image deterioration.SOLUTION: A camera module has a solid-state imaging device 14 comprising a silicon substrate 11 and a support substrate 13 fixed to the surface of the silicon substrate 11 via a first adhesive 12, a bottomed cylindrical lens holder 16 fixed on the device 14 and containing a lens 15, and a bottomed cylindrical shield 17 covering a part of the lens holder 16 and the solid-state imaging device 14. An amorphous layer 24 is formed by ion implantation on the rear-surface side of the silicon substrate 11.
申请公布号 JP2011205222(A) 申请公布日期 2011.10.13
申请号 JP20100068360 申请日期 2010.03.24
申请人 TOSHIBA CORP 发明人 KOSEKI YOSHIAKI
分类号 H04N5/335;G02B7/02;H04N5/225 主分类号 H04N5/335
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