| 摘要 |
The disclosed power conversion device is provided with: a metallic housing which has an internal storage space with a lid at one vertical end and a floor closing the other vertical end; a passage forming body which forms a refrigerant passage along the side area inside the housing on the floor side vertically; multiple power semiconductor modules housing semiconductor chips and disposed such that DC terminals and control terminals for controlling operation of the semiconductor chips protrude externally; a capacitor module which, disposed centrally relative to the refrigerant passage formed along the side of the housing, is provided with DC terminals; an AC busbar assembly disposed more to the lid side in the vertical direction of the housing than the capacitor module and the refrigerant passage; and a driver circuit disposed on the lid side in the vertical direction. In a state inserted into the refrigerant passage, each power semiconductor module is fixed to the passage forming body, and the AC busbar assembly has multiple AC busbars and multiple fixing units for fixing said assembly. |
