| 摘要 |
<p>A multi-layer light-emitting diode array element includes a substrate plate (1), an encapsulation module (3), a lead frame (5) and a cover (10). The substrate plate (1) is positioned on the lowermost layer of the LEDs. The substrate plate (1) is integrated with the lead frame (5) by the encapsulation module (3). The LED chip array is arranged on the substrate plate (1), and the LEDs are electrically connected to the lead frame (5). The cover (10) is combined with the encapsulation module (3). Heat generated by the LEDs is absorbed and dissipated directly by the substrate plate (1), and the density of LEDs can be changed under the different circumstance.</p> |
