METHOD FOR MANUFACTURING PIEZOELECTRIC FILM-TYPE DEVICE

摘要

A substrate (20) is prepared. A "piezoelectric material layer (32a) before baking" that changes to a piezoelectric film by baking is formed above a first principal surface (20a) of the substrate (20). A first mask (131) is formed above the piezoelectric material layer (32a). The "piezoelectric material layer (32a) that is present in a portion in which no first mask (131) is present" is removed by projecting a projection material containing abrasive grains and/or an organic solvent to the first principal surface (20a) of the substrate (20). Thereafter, the first mask (131) is removed, and the piezoelectric material layer (131) is baked. The substrate (20) has a hollow portion (20c), but is not required to have the hollow portion (20c).