发明名称 STRESS COMPENSATION FOR LARGE AREA GALLIUM NITRIDE OR OTHER NITRIDE-BASED STRUCTURES ON SEMICONDUCTOR SUBSTRATES
摘要 A method includes forming (402) a stress compensating stack (104) over a substrate (102), where the stress compensating stack has compressive stress on the substrate. The method also includes forming (406) one or more Group III-nitride islands (106) over the substrate, where the one or more Group III-nitride islands have tensile stress on the substrate. The method further includes at least partially counteracting (408) the tensile stress from the one or more Group III-nitride islands using the compressive stress from the stress compensating stack. Forming the stress compensating stack could include forming one or more oxide layers (202, 206) and one or more nitride layers (204) over the substrate. The one or more oxide layers can have compressive stress, the one or more nitride layers can have tensile stress, and the oxide and nitride layers could collectively have compressive stress. Thicknesses of the oxide and nitride layers can be selected to provide the desired amount of stress compensation.
申请公布号 WO2011084269(A3) 申请公布日期 2011.10.13
申请号 WO2010US58296 申请日期 2010.11.30
申请人 NATIONAL SEMICONDUCTOR CORPORATION;RAMDANI, JAMAL 发明人 RAMDANI, JAMAL
分类号 H01L21/336;H01L21/20;H01L21/205;H01L29/78 主分类号 H01L21/336
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