| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, to provide a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling, furthermore, to provide a printed wiring board using a metal-clad laminate prepared by using the prepreg and/or the prepreg or the epoxy resin composition, and capable of easily conducting an ENEPIG step, and to provide a semiconductor device excellent in performance by using the printed wiring board.SOLUTION: There is provided an epoxy resin composition which comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of ≥1 nm and ≤100 nm, and a silica particle having an average particle diameter larger than that of the silica nanoparticle and of ≥0.1 μm and ≤5.0 μm. |
