| 摘要 |
PROBLEM TO BE SOLVED: To provide a module substrate which includes a surface metallic layer of a blind via by field plating with a land and concurrently satisfies connection reliability between a bump provided at a terminal of a semiconductor device with a reduced diameter and the land of the module substrate and connection reliability between the land and the blind via, and a method of manufacturing the substrate.SOLUTION: A wiring pattern including the land and solder resist are provided on a surface of the module substrate. A height at the center of the land is equal to or higher than a height of the solder resist, and a height in the vicinity of the land and a height of the wiring pattern outside the land are lower than the height of the solder resist. Such a module substrate and a method of manufacturing the module substrate are provided. |
