发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that prevents a lift pin from breaking even when a substrate elevation member is moved to an upper position with a top plate lowered in a state wherein elevation operation of the substrate elevation member is not restricted.SOLUTION: The substrate processing apparatus 22 that supplies a processing liquid to a substrate W arranged at a prescribed processing position and processes the substrate W with the supplied processing liquid includes the substrate elevation member 90 which is provided to lift and lower the substrate W between the processing position and upper position above the processing position, a placement portion 91b which is provided protruding upward from the substrate elevation member 90 and on which the substrate W to be lifted is placed, a top plate portion 110 which is provided to be elevated to above the substrate W arranged at the processing position and covers the substrate W from above in a lowered state, and a contact preventive portion 130 which is provided to the top plate portion 110 and prevents the placement 91b and top plate portion 110 from coming into contact with each other when the substrate elevation member 90 comes into contact with the top plate portion 110.
申请公布号 JP2011205026(A) 申请公布日期 2011.10.13
申请号 JP20100073234 申请日期 2010.03.26
申请人 TOKYO ELECTRON LTD 发明人 TOJIMA JIRO
分类号 H01L21/683 主分类号 H01L21/683
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