ADHESIVE COMPOSITION AND ADHESIVE TAPE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition enabling the crosslinking polymerization reaction of the thermosetting polyimide based resin composition to proceed without essentially requiring a high temperature condition, moreover enabling the crosslinking polymerization reaction to proceed sufficiently without requiring a long period of time; and to provide an adhesive tape using the same.SOLUTION: The adhesive composition which enables a crosslinking polymerization reaction to proceed sufficiently without requiring high temperature and a long period of time can be obtained by using an adhesive composition including a thermosetting polyimide based resin composition and an energy sensitive base generating agent which generates a base by a heat or energy ray. Furthermore, the adhesive tape can be obtained by using such an adhesive composition.