| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for mounting semiconductor elements in which when a semiconductor element such as an SLI having ball-shaped solder bumps is mounted on a package substrate having preliminary solders on electrodes, both are mounted with high reliability by absorbing variance in height and a relative position shift of each preliminary solder due to warpage of the substrate, and to provide a method of manufacturing the circuit board for semiconductor element mounting.SOLUTION: On the package substrate 1, columnar preliminary solders (solder structures 4 for connection formed by die pressing) each having a concave region which is hollowed at a center part on a top surface as compared with a peripheral part are formed by press processing using a die 5 for tip parts, and the LSI is thereby mounted by flip-chip bonding the solder bumps. The outer peripheral of the tip part of each preliminary solder is made higher than the center part to increase the flexibility of contacting and joining between the solder bump and preliminary solder in horizontal and vertical directions, thereby suppressing a connection defect due to warpage of the substrate. |
