发明名称 Apparatuses and methods for irradiating a substrate to avoid substrate edge damage
摘要 Apparatuses and methods are provided for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region. An image having an intensity sufficient to effect thermal processing of the substrate is scanned across the upper surface of the substrate. The image scanning geometry allows processing the central region of the substrate at a substantially uniform temperature without damaging the outer edge. In some instances, the image may be formed from a beam traveling over at least a portion of the central region so that no portion thereof directly illuminates any portion of the edge when the image is scanned across the periphery region. The substrate may be rotated 180° or the beam direction may be switched after part of the scanning operation has been completed.
申请公布号 US2011249071(A1) 申请公布日期 2011.10.13
申请号 US201113164700 申请日期 2011.06.20
申请人 ULTRATECH, INC. 发明人 GREK BORIS;MARKLE DAVID A.
分类号 B41J2/435 主分类号 B41J2/435
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