ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

摘要

Disclosed are: an electronic component which has an excellently reliable sealing structure; and a method for producing the electronic component. Specifically disclosed is an electronic component (1) which comprises: an electronic component main body (10); sealing members (11, 12) that seal the electronic component main body (10); and adhesive layers (13a, 13b) that respectively bond the electronic component main body (10) with the sealing members (11, 12). Sealing spaces (1a, 1b) are respectively formed between the electronic component main body (10) and the sealing members (11, 12). The adhesive layers (13a, 13b) contain an organic filler (15) and an inorganic filler (16). The organic filler (15) is in contact with both the electronic component main body (10) and the sealing members (11, 12). The inorganic filler (16) has a minimum particle diameter that is smaller than the thickness of the adhesive layers (13a, 13b). When viewed from the thickness direction of the adhesive layers (13a, 13b), the inorganic filler (16) intervenes between the organic filler (15) and the electronic component main body (10) and between the organic filler (15) and the sealing members (11, 12).