| 摘要 |
<p>Provided is a Cu-Zn alloy strip which is a copper alloy containing 2-12 mass% Zn, with the remainder comprising Cu and incidental impurities, and in which the frequency of twin-crystal boundaries is 40-70%. The alloy strip has satisfactory resistance to repeated flexing and satisfactory weldability and is suitable for use as a tab material for connecting rechargeable cells. The alloy strip may further contain 0.1-0.8 mass% Sn, and may have an aspect ratio of 0.3-0.7 in terms of aspect ratio between crystal grain diameter in the direction parallel to the rolling direction and crystal grain diameter in a direction perpendicular to the rolling direction. The alloy strip may further contain at least one of Ni, Mg, Fe, P, Al, and Ag in a total amount of 0.005-0.5 mass%. Also provided is a Sn-plated Cu-Zn alloy strip which is obtained by plating the Cu-Zn alloy with Sn in a thickness of 0.3-2 µm.</p> |
