| 摘要 |
<p>Disclosed is an electronic device comprising a circuit board on which an electronic component is mounted using solder, wherein short-circuiting between the terminal electrodes during flip-chip mounting cannot easily occur. The electronic device (1) comprises: an electronic component (10) having a plurality of terminal electrodes (12); a circuit board (20) formed with wiring (22); the wiring (22); solder (30) that joins the terminal electrodes (12); and a resin-filling layer (40) which fills the space between the electronic component (10) and the circuit board (20) in such a way as to surround the solder (30). A concave section and/or a convex section (14) is formed between adjacent terminal electrodes (12) on the surface on the side of the electronic component (10) where the terminal electrodes (12) are formed.</p> |
