ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROCESSING

摘要

Even when using a device that bonds a dicing sheet directly to the underside of a wafer, the disclosed adhesive sheet for semiconductor wafer processing can be easily peeled off after a dicing step is finished and can drastically reduce the adherence of contaminants. Said adhesive sheet comprises a radiotransparent resin base film and an adhesive layer formed on top of said resin base film. The adhesive layer may use a radiation-curable resin composition (I) that contains between 0.1 and 10 mass parts of a photopolymerization initiator (b), with a weight-average molecular weight less than 1,000 as measured by gel permeation chromatography calculated with polystyrene as the reference substance, per 100 mass parts of a base resin consisting primarily of a polymer (a) in which a residue, which has a (meth)acryl monomer part with a group containing a radiation-curable carbon-carbon double bond, is bonded to the main-chain repeating unit. Alternatively, the adhesive layer may use a radiation-curable resin composition (II) that contains, per 100 mass parts of a base resin: between 1 and 300 mass parts of a compound that has a weight-average molecular weight of at most 10,000, with each molecule having at least two photopolymerizable carbon-carbon double bonds; and between 0.1 and 10 mass parts of a photopolymerization initiator with a weight-average molecular weight less than 1,000 as measured by gel permeation chromatography calculated with polystyrene as the reference substance.