发明名称 METHOD OF MONITORING POLISHING, POLISHING METHOD, POLISHING MONITORING APPARATUS, AND POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method capable of accurately monitoring a progress of polishing and detecting an exact end point of polishing.SOLUTION: In this method, light is cast on a substrate during polishing of the substrate, and reflection light from the substrate is received and the intensity of the reflection light is measured for each wavelength. Then, a spectrum indicating the relation between the intensity and the wavelength is generated from the measured intensities of the reflection light. An amount of change in spectrum per predetermined period of time is calculated. Amounts of change in spectrum are accumulated over the polishing time to calculate an accumulated amount of change in spectrum. Based on the accumulated amount of change in spectrum, a progress of substrate polishing is monitored.
申请公布号 JP2011205070(A) 申请公布日期 2011.10.13
申请号 JP20110022650 申请日期 2011.02.04
申请人 EBARA CORP 发明人 KOBAYASHI YOICHI
分类号 H01L21/304;B24B37/013;B24B49/12 主分类号 H01L21/304
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