| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method, along with a production management device and a production management system, capable of manufacturing a semiconductor device without reducing productivity even under exposure conditions that deteriorate characteristics of an exposure device.SOLUTION: The production management system is connected to an exposure device and has a prediction unit 14 and a plan changing unit 16. When a specified substrate processing plan is executed, the prediction unit predicts a change in characteristics of each exposure device PM1-PMn caused by continuous passing of light L through each exposure device PM1-PMn. When the change in characteristics exceeds a threshold during exposure processing, the prediction unit acquires the time when the change in characteristics exceeds the threshold. Before reaching the time when the change in characteristics exceeds the threshold, the plan changing unit changes and defines again the substrate processing plan so that the characteristics are equalized in each of the exposure devices PM1-PMn. |
