| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared sensor module which suppresses a reduction of detecting accuracy caused by a temperature variation of surrounding environment or heating of IC element.SOLUTION: The infrared sensor module, wherein: a thermal infrared sensor 100 and temperature compensating element 101 are constructed in the same structure; an IC element 102 processes in differential amplification an output signal of the thermal infrared sensor 100 and output signal of the temperature compensating element 101. Within a package 103, an infrared intercepting structure 106, is arranged which prevents a first infrared processed in incidence from the outside of the package 103 to the inside, a second infrared radiated from the IC element 102 caused by a heating of the IC element 102, and third infrared radiated from a package lid 105 from reaching the temperature compensating element 101; and in the infrared intercepting structure 106, a communicating part 165, making a first space K1 on the inner side of the infrared intercepting structure 106 communicate with second space K2 on the outer side of the infrared intercepting structure 106, is arranged. |
