发明名称 |
LASER BEAM MACHINING METHOD AND BRITTLE MATERIAL SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining method by which a brittle material substrate such as a sapphire substrate is divided into pieces without causing scattering objects and even a comparatively thick substrate is easily divided into pieces with a reduced scanning frequency.SOLUTION: The laser beam machining method is for dividing a brittle material substrate into pieces by irradiating it with a pulse laser beam and includes a first and a second steps. In the first step, the brittle material substrate is irradiated with a pulse laser beam having a prescribed repeating frequency so that a converging point is situated inside the brittle material substrate to form a modified layer therein. In the second step, the pulse laser beam is scanned along a planned dividing line. Then, through the above steps, cracks are developed for the thickness t of the brittle material substrate in a length of 15-55% of the thickness t from the modified layer to the surface of the substrate. |
申请公布号 |
JP2011200926(A) |
申请公布日期 |
2011.10.13 |
申请号 |
JP20100072480 |
申请日期 |
2010.03.26 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
HATA TSUYOSHI;SHIMIZU SEIJI |
分类号 |
B23K26/38;B23K26/00;B28D5/00;C30B29/20;C30B33/04 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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