FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a fabric type semiconductor device package capable of minimizing a feeling of an alien substance in clothing and of improving productivity and a method of manufacturing the same.SOLUTION: The fabric type semiconductor device package comprises a fabric printed circuit substrate having a woven fabric and a first lead part formed by patterning a conductive material on the woven fabric; a semiconductor device having an electrode part connected to the lead part of the fabric printed circuit substrate; and a molding that seals the fabric printed circuit substrate and the semiconductor device. The first lead part is electrically connected with another fabric semiconductor device by stitching the terminal part of the first lead part with the woven fabric through a conductive fiber electrically connected to another fabric semiconductor device, or by stitching the terminal part of the first lead part with a second lead part of the fabric printed circuit substrate electrically connected to the another fabric semiconductor device and with the woven fabric.