| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method that includes a wafer processing process of executing liquid chemical processing, heating treatment or processing accompanied by heat generation, and is capable of reliably processing a wafer without breakage or the like.SOLUTION: The wafer processing method includes a support plate fixing process of fixing a wafer to a support plate through an adhesive composition containing an adhesive component and a gas generator that generates a gas by stimulation, a wafer processing process of executing liquid chemical processing, heating treatment or processing accompanied by heat generation to the surface of the wafer fixed to the support plate, and a support plate peeling process of peeling the support plate from the wafer by stimulating the wafer after processing and generating a gas from the gas generator. |
