ELECTRONIC ASSEMBLIES AND METHODS OF FORMING ELECTRONIC ASSEMBLIES
摘要
An electronic assembly includes an electronic device having high- resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and i electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
申请公布号
WO2011127328(A2)
申请公布日期
2011.10.13
申请号
WO2011US31645
申请日期
2011.04.07
申请人
INTELLIPAPER, LLC;DEPAULA, ANDREW;AAMODT, LARRY;VYHMEISTER, RONALD