发明名称 ELECTRONIC ASSEMBLIES AND METHODS OF FORMING ELECTRONIC ASSEMBLIES
摘要 An electronic assembly includes an electronic device having high- resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and i electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
申请公布号 WO2011127328(A2) 申请公布日期 2011.10.13
申请号 WO2011US31645 申请日期 2011.04.07
申请人 INTELLIPAPER, LLC;DEPAULA, ANDREW;AAMODT, LARRY;VYHMEISTER, RONALD 发明人 DEPAULA, ANDREW;AAMODT, LARRY;VYHMEISTER, RONALD
分类号 H05K3/34;H05K1/16 主分类号 H05K3/34
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