| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a photospacer having superior alkali developability, exposure sensitivity and resolution, a cured product thereof exhibiting superior adhesion to a substrate and superior elastic recovery characteristics even when a low temperature treatment is adopted.SOLUTION: The photosensitive resin composition is an alkali-developable negative photosensitive resin composition (Q) for a photospacer comprising a polyfunctional (meth)acrylate monomer (A) containing various acid groups or salts thereof, a photoradical polymerization initiator (B), a cationic polymerizable compound (C) having two or more epoxy groups and/or alkoxy groups in a molecule thereof, a siloxane compound (D) having two or more hydrolyzable alkoxy groups, and an acid generator (E), wherein a photospacer formed by post-baking at ≤200°C a cured product of the composition by light irradiation shows an elastic recovery rate of ≥50%. |
